Building the Future of Biotechnology, Semiconductors & National Defense R&D

A 280,000+ sq ft innovation campus uniting GMP biotech, semiconductor pilot fabs, and defense microelectronics under one secure ecosystem.

BioDeCTech’s integrated GMP–semiconductor–defense campus directly supports national initiatives in biomedical security, semiconductor resilience, and defense microelectronics innovation.

Building A – Biotech GMP → Building B – Semiconductors → Building C – Defense Microelectronics

Building the Future of
Biotechnology, Semiconductors & Defense

A 280,000+ sq ft national innovation campus — three multi-level facilities uniting ISO/GMP biotech labs, semiconductor pilot fabs, and SCIF-ready defense microelectronics.

Explore the Campus Request NDA / Data Room
Transparent, federal-grade architecture — designed for NIH, CHIPS, and DoD alignment.
Futuristic research equipment
280,000+
sq ft Campus
3
Specialized Buildings
ISO 1–8
Cleanrooms
99-Year
Campus Control

Campus Includes

🧬 National GMP Biotech Center (Functional Scope)

ISO 1–8 GMP cleanrooms • cGMP diagnostics & manufacturing • BSL-supported QC/QA.

Aligned: NIH
BARDA
DHS

⚙️ Next-Gen Semiconductor Hub (Functional Scope)

ISO 1–6 cleanrooms • Advanced packaging & pilot fab • AI/quantum hardware R&D.

CHIPS Act
DOE
NIST

🛡️ National NanoDefense Technologies (Functional Scope)

ISO 1–5 nanofab zones • SCIF-ready microelectronics • sensors & secure AI hardware.

DoD
DIU
DARPA
Title III

Integrated GMP + ISO Ecosystem

  • ISO 1–8 suites with pressure cascades, HEPA/ULPA filtration, and environmental monitoring.
  • BSL-supported labs and QC/QA suites for translational biotech and regulated manufacturing.
  • Tool bays for lithography, deposition, metrology, packaging, and reliability testing.
  • Hardened, SCIF-ready envelope and secure networks for defense microelectronics programs.
Eligibility & Alignment: NIH • BARDA • DOE • NIST • DoD • DIU • DARPA • CHIPS Act • TEDCO/BioMaryland • Maryland Commerce
Cleanroom manufacturing line

Federal & State Program Alignment

We present alignment and eligibility — not claims of awards — to support collaborative public–private funding streams.

Readiness for Near-Term Obligation

Phase 1 — Building A (Biotech) is Shovel-Ready

  • CGU (Change-of-Use) path identified; scope enables rehabilitation + vertical expansion.
  • Utilities / MEP envelopes pre-matched for ISO 1–8 suites; dedicated QC/QA and BSL support.
  • Site control and 99-year campus governance enable long-term federal programming.
  • Schedule: Phase 1 procurement can commence within the near term upon award.
Team planning in controlled environment

Capabilities & Compliance Matrix

ISO Cleanrooms
Biotech: 1–8 • Semiconductors: 1–6 • Defense/Nano: 1–5
GMP / cGMP Readiness
Biotech: Yes • Semiconductors: N/A • Defense/Nano: Yes
SCIF-Ready Envelope
Biotech: N/A • Semiconductors: N/A • Defense/Nano: Yes
QA/QC & Metrology
Integrated across tracks
Cyber/Physical Security
FedRAMP-aligned networks (Bio) • Segmented/Zero-Trust (Semi) • SCIF protocols (Defense)
Workforce & Training
Bio manufacturing • Packaging & tool • Secure microelectronics

Workforce, Partners & Impact

Workforce Development

  • Stackable credentials in GMP biotech, advanced packaging, and trusted microelectronics.
  • Apprenticeships with local colleges and veteran pipelines; priority for underserved communities.
  • Annual training target: 250+ seats across three tracks.

Economic & Equity Impact

  • Direct jobs: 350–500 across phases; induced jobs via suppliers and services.
  • Small-biz set-asides: goals for MBE/WBE/VBE participation in procurement.
Cleanroom team and instruments

Phased Roadmap

Phase 1 — 2025: Building A (Biotech). CGU + vertical expansion; ISO 1–8; NIH/BARDA/DHS; DoD biosecurity.
Phase 2 — 2025–2026: Building B (Semiconductors). Advanced packaging & pilot fab; ISO 1–6; CHIPS Act, DOE, NIST.
Phase 3 — 2026+: Building C (Defense/Nano). SCIF-ready defense microelectronics; ISO 1–5; DoD/DIU/DARPA; Microelectronics Commons.

Partner with America’s Next-Gen Innovation Campus

Government • Industry • Research — request a meeting or NDA to access technical appendices (schematics, CAD fly-through*, validation plan).
*3D CAD rendering in production.

Biotech Capabilities

ISO 1–8 GMP cleanrooms with pressure cascades and HEPA/ULPA air systems.
cGMP diagnostics & manufacturing suites; BSL-supported QC/QA.
Cold-chain, quarantine, weigh/dispense, validated environmental monitoring.
QA/QC metrology lab; documentation aligned to FDA expectations.

Semiconductor Capabilities

ISO 1–6 cleanrooms for advanced packaging and wafer-level processes.
Tool bays for lithography, deposition, metrology, reliability testing.
AI/quantum hardware prototyping; PILOT fab line with segmented networks.
Supplier engagement + workforce pipelines to accelerate CHIPS-aligned deliverables.

Defense Microelectronics & Nano

ISO 1–5 nanofab zones with hardened envelope and secure access controls.
SCIF-ready design, dual fiber pathways, and cyber-segmented / Zero-Trust networks.
Sensors, secure AI hardware, advanced materials & coatings test bays.
Title III / Microelectronics Commons-aligned collaborations & transition to DoD users.

Strategic Location

Located within the Washington–Maryland Innovation Corridor, just minutes from Washington, DC — strategically positioned near major research and defense agencies. (Exact address undisclosed for security.)

Approx. travel time to Washington, DC 15 minutes.
This corridor qualifies under multiple state and federal innovation incentive zones for biotechnology and advanced manufacturing Grant alignment zones: Maryland Commerce, TEDCO BioMaryland, CHIPS Act Regional Tech Hub.

GMP + ISO Cleanrooms

ISO 1–8 suites, pressure cascades, HEPA/ULPA, BSL-ready QC/QA.

Semiconductor Pilot Fab

Advanced packaging, lithography, deposition, metrology, reliability.

Defense Microelectronics

SCIF-ready envelope, secure networks, sensors & AI hardware.

Program Alignment

NIH • BARDA • CHIPS Act • DOE • NIST • DoD • DIU • DARPA.

Phased Roadmap

Phase 1: Building A (GMP). Phase 2: Building B (Semis). Phase 3: Building C (Defense).

Strategic Location

Washington–Maryland corridor — minutes to DC & federal agencies.

Innovating Tomorrow

BioDeCTech is at the forefront of biotechnology, semiconductor, and defense research, creating a national innovation campus for advanced development and collaboration.

BioDeCTech is strategically positioned within the Washington–Maryland Innovation Corridor — just minutes from Washington, DC and major federal R&D hubs.

Our proximity to NIH, BARDA, DOE, NIST, and DoD programs enables faster collaboration, easier access to funding, and secure engagement with government and industry partners.

Located approximately 15 minutes from downtown DC, the BioDeCTech campus offers accessibility, privacy, and room for next-generation growth.

A person wearing safety glasses and gloves operates a scientific instrument, possibly in a laboratory setting. They hold a small vial near a device labeled 'Applied Nanofluorescence' while a computer monitor shows data graphs and charts in the background.

Innovative Research Solutions

A close-up view of a microchip on a circuit board being worked on with precision instruments. The scene is illuminated, highlighting the intricate electronic components and the fine details of the circuit.
We specialize in cutting-edge research across biotechnology, semiconductors, and defense.
A series of computer microchips are aligned in a diagonal pattern against a black background filled with binary code and blue curved lines. The microchips feature intricate circuitry details.
Our campus features state-of-the-art facilities for semiconductor development and manufacturing.
A person wearing a blue protective suit and mask is working in a laboratory setting. They are handling petri dishes on a counter with a digital display and laboratory equipment nearby. The room has clean, white walls and a blue door.

Our cleanroom facilities support ISO-certified processes for scalable biotech and semiconductor research, ensuring full GMP and federal compliance.